AgGeSbTe thin film as a negative heat-mode resist for dry lithography

نویسندگان

چکیده

An AgGeSbTe thin film is proposed as a negative heat-mode resist for dry lithography. It possesses high etching selectivity with the rate difference of 62 nm/min in CHF3/O2 mixed gases. The etched sidewall steep without obvious lateral corrosion. lithographic characteristics and underlying physical mechanisms are analyzed. Besides, results X-ray diffraction, Raman spectroscopy, photoelectron spectroscopy further indicate that laser irradiation causes formation Ge, Sb, AgTe crystals, which basis selectivity. In addition, Si to 19 at SF6/Ar gases, possessing good resistance. believed promising

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

SUEX Dry Film Resist – A new Material for High Aspect Ratio Lithography

SUEX epoxy Thick Dry Film Sheets (TDFS) are a promising material for a wide range of MEMS applications. They contain a cationically cured modified epoxy formulation utilizing an antimony-free photo acid generator (PAG). A highly controlled solvent-less process provides uniform resist coatings between two throw-away layers of protective polyester (PET) film in varying thicknesses ranging from 10...

متن کامل

Laminated Dry Film Resist for Microengineering Applications

An innovative technology with a dry film resist (Riston) for use in microsystem engineering applications is presented. In view of the simplicity of forming a controllable resist thickness ( 20 100 ~n/level ), inherent planarization for multilevel processes in 3D microsystems and high, stable over-wafer thickness uniformity, we have investigated the use of dry film resists to realise high aspect...

متن کامل

Polystyrene negative resist for high-resolution electron beam lithography

We studied the exposure behavior of low molecular weight polystyrene as a negative tone electron beam lithography (EBL) resist, with the goal of finding the ultimate achievable resolution. It demonstrated fairly well-defined patterning of a 20-nm period line array and a 15-nm period dot array, which are the densest patterns ever achieved using organic EBL resists. Such dense patterns can be ach...

متن کامل

DRY FILM RESIST FOR FAST FLUIDIC PROTOTYPING P.Vulto1,

Dry film photoresist is used for creating microfluidic structures by sandwiching the patterned resist in between of two substrates. The technique is applied for creating hybrid biochips for dielectrophoretic cell manipulation. Multiple level lithography is demonstrated and biocompatibility of the resist is proven. Due to simple fabrication procedures the resist can be processed in a low-tech en...

متن کامل

Dry Lithography of Large-Area, Thin-Film Organic Semiconductors Using Frozen CO2 Resists

To address the incompatibility of organic semiconductors with traditional photolithography, an inert, frozen CO(2) resist is demonstrated that forms an in situ shadow mask. Contact with a room-temperature micro-featured stamp is used to pattern the resist. After thin film deposition, the remaining CO(2) is sublimed to lift off unwanted material. Pixel densities of 325 pixels-per-inch are shown.

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Chinese Optics Letters

سال: 2022

ISSN: ['1671-7694']

DOI: https://doi.org/10.3788/col202220.031601